HOME

ABOUT US

Contact Us

 
 

TIA Series Thermally Conductive Tape
 
 

  The TIA Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

 

 
Features  
High bond strength to a variety of surfaces Double sided pressure sensitive adhesive tape
 High performance, thermally conductive acrylic adhesive

 

 

Typical Applications Include
Mount heat sink onto BGA graphic processor or drive processor
Mount heat spreader onto power converter PCB or onto motor control PCB.
High performance, thermally conductive acrylic adhesive
Can be used instead of heat cure adhesive, screw mounting or clip mounting.
 
 
 
 

Item

Color

Thickness(mm)

Thermal Conductivity(W/mK)

Peel Adhesion (g/inch2)

Dielectric Breakdown Voltage (VAC)

Specification

MSDS

ROHS

TIA800

White

0.127 ~ 0.508

0.9

1200

>2500

Detailed data

Detailed data

Detailed data

TIA800FG

White

0.152 ~ 0.508

0.8

1200

>3800

Detailed data

Detailed data

Detailed data

   

Thermazig, Inc. 3709 Pender St Burnaby B.C. Canada Email:sales@thermazig.com