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TIC Series Low Melting Point Thermal Interface Material
 
 

     TIC Series materials are polymers that reinforce heat and featured by phase transformation. In room temperature, TIC series materials are solid and easy to process. However, in operating temperature when the states of the component materials are about to change, TIC series materials quickly get softened and melted so as to completely fill the gaps between the heat dissipation elements and the electronic components with highly efficient heat conduction.

 

 
Features  
  Proprietary technology prevents excessive
 pump-out after initial heat cycle
 With naturally tacky and requires no adhesive
 coating or heat sink preheat for attachment
 Low thermal resistance at low pressures
 It is supplied the in rolls with a top tabbed liner
 for easy manual or large volume automated

Application
High frequency microprocessors
Notebook and desktop PCs
Computer servers
Thermal test stands
DC/DC Converts
Memory modules
Cache chips IGBTs
 

Item

Color

Thickness         (mm)

Thermal Impedance@50psi             (℃-in2/W)

Phase Change Softening Temperature(℃)

Continuous Use Temp(℃)

Specification

MSDS

ROHS

TIC805A

Ashy

0.127

0.02

50~60

-45~125

Detailed data

Detailed data

Detailed data

TIC805P

Pink

0.127

0.024

50~60

-45~125

Detailed data

Detailed data

Detailed data

TIC805Y

Yellow

0.127

0.024

50~60

-45~125

Detailed data

Detailed data

Detailed data

   

Thermazig, Inc. 3709 Pender St Burnaby B.C. Canada Email:sales@thermazig.com