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TIF Series Thermally conductive gap fillers
 
 

     TIF Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

 
Features  
 Soft and Compressible for low stress applications
 Naturally tacky needing no further adhesive coating
 Good thermal conductive
 Available in varies thickness

Application
Cooling components to the chassis of frame
High speed mass storage drives
RDRAM memory modules
Micro heat pipe thermal solutions
Automotive engine control units
Telecommunication hardware
Handheld portable electronics
Semiconductor automated test equipment (ATE)

Item

Color

Thickness                           (mm)

Hardness            (Shore A )

Thermal Conductivity (W/m-K)

Continuous Use Temp (℃)

Specification

MSDS

ROHS

TIF600G

Garnet

0.254-5.08

35

6.2

-50~200

Detailed data

Detailed data

Detailed data

TIF600

Blue/Violet

0.254-5.08

30

4.7

-50~200

Detailed data

Detailed data

Detailed data

TIF500S

Blue

0.254-5.08

25

3.0

-50~200

Detailed data

Detailed data

Detailed data

TIF500

Violet

0.254-5.08

10

2.6

-50~200

Detailed data

Detailed data

Detailed data

TIF400

Yellow

0.254-5.08

30

2.0

-50~200

Detailed data

Detailed data

Detailed data

TIF100

Green

0.254-10.16

10

1.5

-50~200

Detailed data

Detailed data

Detailed data

TIF100soft

Violet/Green

0.254-10.16

8

1.25

-50~200

Detailed data

Detailed data

Detailed data

   

Thermazig, Inc. 3709 Pender St Burnaby B.C. Canada Email:sales@thermazig.com